Company Details

  • Storm Circuit Technology Ltd

  •  [Guangdong,China]
  • Business Type:Manufacturer , Trade Company
  • Main Mark: Americas , East Europe , Europe , North Europe , Worldwide
  • Exporter:91% - 100%
  • Certs:ISO9001, Test Report, UL
  • Description:ENEPIG PCB,Aluminum PCB,Rigid PCB,Flexible PCB
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Storm Circuit Technology Ltd

ENEPIG PCB,Aluminum PCB,Rigid PCB,Flexible PCB

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ENEPIG PCB

Product categories of ENEPIG PCB, we are specialized manufacturers from China, ENEPIG PCB, Aluminum PCB suppliers/factory, wholesale high-quality products of Rigid PCB R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
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urgent 3 layer 0.8mm RO4350B Green Solder ENEPIG PCB

Model No. : Storm-0191

PCB features: 1.Layer: 3 2.Material: Rogers 3.Thickness:0.8mm 4.Copper: 1OZ 5.Mini hole: 0.25mm 7.Mini width/space: 0.15mm/0.15mm 8.Finish: ENEPIG Our manufacturing capability: Manufacture capability layers: 1-32 layers Materials: CEM1, CEM3,...

China ENEPIG PCB of with CE
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0.2mm FR4 ENEPIG PCB

Model No. : Storm-0010

what is ENEPIG?ENEPIG-Electroless Nickel Electroless Palladium Immersion Gold is a surface finish for Printed Circuit Boards.ENEPIG works well with lead free and conventional eutectic solder alloys.This is the best way for gold wire bonding. We can...

China Manufacturer of Aluminum PCB
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China ENEPIG PCB Suppliers
Do you know what is ENEPIG in PCB?
What is ENEPIG?ENEPIG-Electroless Nickel Electroless Palladium Immersion Gold is a surface finish for Printed Circuit Boards.ENEPIG works well with lead free and conventional eutectic solder alloys.This is the best way for gold wire bonding. Advantages for ENEPIG:

1.[Black Nickel" free – no possibility of grain boundary corrosion of nickel surface by immersion gold
2.Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus ensuring good solderability
3.Palladium completely dissolves into solder, without leaving an excessively high P% rich interface, exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
5.Withstands multiple lead-free reflow soldering cycles
6.Demonstrates excellent gold wire bondability

7.Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold


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