Storm Circuit Technology Ltd
Analysis and Comparison of Heat Dissipation Difference between Ceramic Heat Dissipation Substrate and MCPCB
With the rapid development of science and technology, the awareness of global environmental protection has risen in recent years. How to effectively develop energy-saving and energy-saving technology...
LED COB type: MCPCB (metal substrate) and ceramic substrate comparison
COB : The Chip On Board (COB) process first covers the wafer placement point with a thermally conductive epoxy resin (usually an epoxy resin doped with silver particles) on the surface of the...
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