Company Details

  • Storm Circuit Technology Ltd

  •  [Guangdong,China]
  • Business Type:Manufacturer , Trade Company
  • Main Mark: Americas , East Europe , Europe , North Europe , Worldwide
  • Exporter:91% - 100%
  • Certs:ISO9001, Test Report, UL
  • Description:Via In Pad PCB,6Layer Via In Pad PCB,Touch Pad PCB,Via In Pad
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Storm Circuit Technology Ltd

Via In Pad PCB,6Layer Via In Pad PCB,Touch Pad PCB,Via In Pad

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Via In Pad PCB

Product categories of Via In Pad PCB, we are specialized manufacturers from China, Via In Pad PCB, 6Layer Via In Pad PCB suppliers/factory, wholesale high-quality products of Touch Pad PCB R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
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4 layer 1.6mm high  TG board

Model No. : Storm-224

Storm Circuit is a professional PCB and PCBA manufacturer in China,we focus on high-mix ,low to medium volume PCB fabrication and PCB assembly service for many years. We can offer full turnkey service job ,including PCB+Components+Program+Testing.We...

China Via In Pad PCB of with CE
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FR4 4 layer 1.2mm Via in pad ENIG PCB

Model No. : Storm-0113

PCB features: 1.Layer: 4 2.Material: FR4 3.Thickness:1.6mm 4.Copper: 1OZ 5.Mini hole: 0.15mm 7.Mini width/space: 0.15mm/0.15mm 8.Finish: Immersion Gold 9.Blind Holes:G2-G3 Our manufacturing capability: Manufacture capability layers: 1-32

China Manufacturer of 6Layer Via In Pad PCB
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6 layer Green Solder blind vias PCB

Model No. : Storm-0206

Storm Circuit is a professional PCB and PCBA manufacturer in China,we focus on high-mix ,low to medium volume PCB fabrication and PCB assembly service for many years. We can offer 6 layer Blind and Barried via PCB,RO4350 PCB,ENEPIG PCB. PCB...

Customized Touch Pad PCB Made in China
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4 layer blue solder BGA via in pad

Model No. : Storm-0179

PCB features: 1.Layer: 4 2.Material: FR4 3.Thickness:1.6mm 4.Copper: 1OZ 5.Mini hole: 0.25mm 7.Mini width/space: 0.15mm/0.15mm 8.Finish: Immersion Gold Our manufacturing capability: Manufacture capability layers: 1-32 layers Materials: CEM1, CEM3,...

Professional Manufacturer of Via In Pad
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4 layer FR4 1.6mm 1OZ black solder ENIG PCB

Model No. : Storm-0151

PCB features: 1.Layer: 4 2.Material: FR4 3.Thickness:1.6mm 4.Copper: 1OZ 5.Mini hole: 0.3mm 7.Mini width/space: 0.2mm/0.2mm 8.Finish: Immersion Gold Our manufacturing capability: Manufacture capability layers: 1-32 layers Materials: CEM1, CEM3,...

China Supplier of Via In Pad PCB
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4 layer HDI Via in pad PCB

Model No. : Storm-0146

PCB features: 1.Layer: 4 2.Material: FR4 3.Thickness:1.6mm 4.Copper: 1OZ 5.Mini hole: 0.3mm 7.Mini width/space: 0.2mm/0.2mm 8.Finish: Immersion Gold 9.HDI:L1-L2 Our manufacturing capability: Manufacture capability layers: 1-32 layers Materials:...

Expert Manufacturer of 6Layer Via In Pad PCB
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8 layer TG170 via in pad PCB

Model No. : Storm-0141

PCB features: 1.Layer: 8 2.Material: FR4 3.Thickness:1.6mm 4.Copper: 2OZ 5.Mini hole: 0.3mm 7.Mini width/space: 0.2mm/0.2mm 8.Finish: Immersion Gold Our manufacturing capability: Manufacture capability layers: 1-32 layers Materials: CEM1, CEM3,...

Competitive Touch Pad PCB China Manufacturer
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4 layer 1.0mm VIa in Pad PCB

Model No. : Storm-0103

There are numerous benefits of via in pad PCB. It helps to increase density, lessen inductance and use finer pitch packages. In via in pad process, a via is directly placed below the device`s contact pads. This enables greater part density and...

High Quality Via In Pad China Manufacturer
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China Via In Pad PCB Suppliers
Via In Pad PCB
What is Via In Pad? In shortly,via in pad is the via holes are at the SMD pad.The vias are very small,usually under 0.3mm.Why and how? First is there is no enough space to layout,you have to put the vias and holes closer even together.Second it helps thermal management and for high frequency boards,it may help improve signals.
Because the SMD pads are for SMD components loading,so the solder can not flow to inner layer or the other side when assemble.That is the most important for via in pad board.
How PCB manufacturers like us to do via in pad board? We will fill all vias with non-conductive epoxy and plate copper over it ,so the vias are flat same as others. Many PCB factories are unable to do such capability.
The key technology is how we fill vias and guarantee there is no any solder (surface finishing) in the holes.
Filled via in pad is a way to achieve intermediate density with an intermediate cost compared to using blind/buried vias. Some of the key advantages associated with using the via in pad technology are:
.Fan out fine pitch (less than .75mm) BGAs
.Meets closely packed placement requirements
.Better thermal management
.Overcomes high speed design issues and constraints i.e. low inductance
.No via plugging is required at component locations
.Provides a flat, coplanar surface for component attachment
Via in big pads are not a big problem.but for BGA,that is technology.As BGA pads are very small,10mil or 12mil,and there is no enough space.Manufacturing is not easy as other boards.
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