4 Layer HDI PCB with 0.38mm pitch BGA

Min hole:0.15mm

Min trace/space: 0.076/0.0/76mm

0.38CSP

Blind Vias:L1-L2

Via in pad, POFV (Plated over filled  vias)

4 layer  1.0mm    Laser drilling

10 Layer HDI PCB with 3/3mil

min hole 0.15mm

BGA

Thickness :1.0mm

Application:Networks

FR4 :4 layer  1.6mm 1oz
Full gold at top and bottom side in units
Soft Gold with 30 micro inch
Edge plating
Black solder mask,white silkscreen

10 Layer rigid-flex PCB  made by Storm Circuit
PCB layers:10 layers
Material:FR4+PI                                                                          
Thickness:1.6mm   +0.2mm                                                       
Min track/space:0.13/0.13mm       
Immersion Gold                                                                 

12 Large PCB made by Storm Circuit

PCB,5.0mm,564*502mm,

countersink holes,pressfit holes +/-0.05mm,,

used in test equipment

HDI PCB

8 Layer HDI PCB Made By Storm Circuit

10 layer RF PCB with RO4350B+FR4
Blind vias L1-L2,L9-L10
Via in pad ,POFV
RO4350B  6.6mil

HDI,L1-L2,L1-L3,L1-L4,L1-L5,L1-L6,L1-L7
8 layer,  TG170 FR4,1.0mm
via in pad.  POFV
min hole:0.1mm
Any Layer HDI structure
min trace/space:0.076/0.076mm
Application:HiFI  headphones
Laser drilling

8 layer PCB

Blind vias L1-L7

TG170. min hole 0.2mm，

Board thickness 3.2mm.

488*1072mm，

Very Large PCB

0.4mm pitch BGA
BGA pad 0.2mm
4 layer 1.6mm
min trace/space 0.1/0.1mm

ENEPIG for RO4350B with blind vias from L1-L2,L3-L4

Two designs,4 layer HDI PCB,0.4mm pitch BGA

4 layer HDI
HDI:L1-L2,L1-L3,
Via in pad
Half hole plating
Quick Turn shipping in 5 days.

4.4mm PCB ,4 Layer
Blind vias L1-L2 ,L3-L4
Countersink holes
Matt Black solder mask
Via in pad
12:1 (Thickness :min hole)